for laptop/mobile PCBA chip QPN QFP PGA rework
Brand Name: FEORLO
Model Number: WDS-750
Key Specifications/Special Features:WDS-750 high-end BGA rework station specifications
1. Touch screen with a human interface, heating time, heating temperature, reflow temperature rate, advanced alarming, vacuum time all can set the touch screen, simple operation, easily learn
2. PLC import from Japan, temperature control module use China famous brand, display three temperature curves, 4 pieces independent temperature sensor, which can measure the different place temperature of the chips, make sure the rework rate
3. Three independent heating temperature zone, each heating temperature zone can independently set the heating temperature, heating time, rate, six heating temperature sections, simulate the reflow oven heating mode preheating, constant, warming, soldering, reflow soldering, cooling
4. Auto feed chips, pick up chips, blowing chips, auto recognition chips place during alignment Multifunction mode weld, remove, mount, manual, realize semi-auto and auto function, meet customer’s requirement
5. High precision K-type closed loop import from the US together with our company special heating way, the soldering range of temperature within ±1° motherboard repair machine
6. Imported optical alignment system with 15’’ high definition monitor, high-precision micrometer adjust X/Y/R axis, make sure the alignment precision within 0.01-0.02mm
7. Top heater and mounting heater design 2–in–1 which can make the mounting more precision, there are many sizes of BGA nozzles which can meet different chips sizes, BGA nozzles can easy change, we accept customize
8. High automatic and precision, completely avoid human operation error; it is good for reworking lead-free craft and double BGA, QFN, QFP, capacitance-type resistor components which can achieve a good result
9. Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result (optional function) Type BGA rework rebelling machine, motherboard repair machine Total power max 6800W Power supply (single phase) 220V AC ±10 50Hz Position way optical lens+ V shape holder + laser positioning Material High sensitive touch screen + temperature control module + PLC + step drive PCB size Max: 500x450mm
Min: 10x10mm Applicable BGA size 0.8mm-8cm Mounting precision ±0.01mm Min chips pitch 0.15mm Mounting BGA weight 1000G PCB thickness 0.5-8mm Thermo-couple Ports 4 pieces Overall dimension (L) 670x (W) 780 x (H) 850mm Weight of machine about 90kg
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